The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Jan. 26, 2021
Applicant:

Seagate Technology Llc, Fremont, CA (US);

Inventors:

Riyan Alex Mendonsa, Minneapolis, MN (US);

Brett R. Herdendorf, Mound, MN (US);

Paul S. Tyler, Shakopee, MN (US);

Assignee:

Seagate Technology LLC, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); C25D 17/10 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
C25D 5/02 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); C25D 17/10 (2013.01); C25D 21/12 (2013.01);
Abstract

The slow speed of conventional selective electroplating and L-PED (and further requirement of a series of masks in the case of selective electroplating) necessary to generate a metallic three-dimensional object makes conventional selective electroplating and L-PED not viable for mass manufacturing metallic three-dimensional objects. The presently disclosed technology generally utilizes electroplating and L-PED technologies with a screen electroplating process. The screen electroplating process disclosed herein is capable of achieving a faster throughput and a lower workpiece temperature than traditional 3D printing processes can provide, particularly traditional metal 3D printing processes. As a result, the presently disclosed screen electroplating process is able to achieve much faster results in printing a complex three-dimensional metallic structure using electroplating.


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