Brandon Rubenstein

This inventor holds 38 USPTO granted patents and 3 published patent applications, primarily in Thermal Management. Top assignees: Hewlett-Packard Development Company, L.p., Hewlett-Packard Company, Hewlett-Packard Development, L.p.. Active years: 2002-2015.

USPTO Granted Patents = 38 (Patent Applications = 3)

% Patents Active = 50.0

Average Co-Inventor Count = 1.9

ph-index = 14

Forward Citations = 492(Granted Patents)

Location History:

Fort Collins, CO (US) (2008)
Loveland, CA (US) (2009)
Loveland, CO (US) (2002 - 2015)

Company Filing History:

35 out of 27,650

Hewlett-Packard Development Company, L.p.

patents

2 out of 9,639

Hewlett-Packard Company

patents

1 out of 89

Hewlett-Packard Development, L.p.

patents

Years Active: 2002-2015

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Areas of Expertise:

Heat Sink

Thermal-Interface Device

Cooling Assembly

Printed Circuit Board

Fluid Flow Control

Electronic Module

Processor Module

Cable Management

Interconnect System

Rackmount Handles

Fastener

Ejection Mechanism

38 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9060436 - Land grid array socket assembly (2015-06-16),

2. 9055698 - Fluid flow control for computing device (2015-06-09),

3. 9019704 - Heat storage by phase-change material (2015-04-28),

4. 8982552 - System for providing physically separated compute and I/O resources in the datacenter to enable space and power savings (2015-03-17),

5. 8599557 - Printed circuit board cooling assembly (2013-12-03),

6. 8542488 - Cooling apparatus for an IC (2013-09-24),

7. 8020608 - Heat sink fin with stator blade (2011-09-20),

8. 7926552 - Jacket for heat dispersion device (2011-04-19),

9. 7619899 - Securable electronic module (2009-11-17),

10. 7567438 - Heat sink with precompressed bias member (2009-07-28),

11. 7544072 - Retractable protection apparatus for electronic device pins (2009-06-09),

12. 7516917 - Management device for excess cabling (2009-04-14),

13. 7480143 - Variable-gap thermal-interface device (2009-01-20),

14. 7420816 - Apparatus and method for installing an electrical support structure (2008-09-02),

15. 7408788 - Device and method for circuit board insertion and removal (2008-08-05),

Sure, I can help you with that! Here is the article about inventor Brandon Rubenstein:

Title: Inventor Spotlight: Brandon Rubenstein

Introduction:

Brandon Rubenstein, a prolific inventor based in Loveland, Colorado, has made significant contributions to the technological landscape with his innovative patents and expertise in the field of technology.

Latest Patents:

Brandon Rubenstein's latest patents include a Land Grid Array Socket Assembly, which revolutionizes socket technology by enhancing contact conductivity and durability, and a Fluid Flow Control System for Computing Devices, designed to optimize cooling efficiency in heat-producing computing devices.

Career Highlights:

Having amassed an impressive total of 38 patents, Brandon Rubenstein has showcased his exceptional talent for developing cutting-edge solutions in the tech industry. His work reflects a keen understanding of technological advancements and a commitment to driving innovation forward.

Collaborations:

Throughout his career, Brandon Rubenstein has collaborated with esteemed companies such as Hewlett-Packard Development Company, L.P., and Hewlett-Packard Company. His partnerships with industry leaders have allowed him to further refine his inventions and bring them to fruition in the market.

Conclusion:

In conclusion, Brandon Rubenstein stands out as a trailblazing inventor whose contributions have significantly impacted the world of technology. His dedication to innovation, coupled with his technical acumen, continues to inspire and drive progress in the field.