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For the Inventor, By the Inventor

Loveland, CO, United States of America

Brandon Rubenstein

This inventor holds 38 USPTO granted patents and 3 published patent applications, primarily in Thermal Management. Top assignees: Hewlett-Packard Development Company, L.p., Hewlett-Packard Company, Hewlett-Packard Development, L.p.. Active years: 2002-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brandon Rubenstein. Retrieved from https://idiyas.com/inventor/brandon-rubenstein

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 38 

% Patents Active = 50.0

Average Co-Inventor Count = 1.9

ph-index = 14

Forward Citations = 492(Granted Patents)


Location History:

  • Fort Collins, CO (US) (2008)
  • Loveland, CA (US) (2009)
  • Loveland, CO (US) (2002 - 2015)

Company Filing History:

goldMedal35 out of 27,667 
 
Hewlett-Packard Development Company, L.p.
 patents
silverMedal2 out of 9,639 
 
Hewlett-Packard Company
 patents
bronzeMedal1 out of 89 
 
Hewlett-Packard Development, L.p.
 patents

Years Active: 2002-2015

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Areas of Expertise:
Heat Sink
Thermal-Interface Device
Cooling Assembly
Printed Circuit Board
Fluid Flow Control
Electronic Module
Processor Module
Cable Management
Interconnect System
Rackmount Handles
Fastener
Ejection Mechanism
38 patents (USPTO):Explore Patents
1. 9060436 - Land grid array socket assembly (2015-06-16),
2. 9055698 - Fluid flow control for computing device (2015-06-09),
3. 9019704 - Heat storage by phase-change material (2015-04-28),
4. 8982552 - System for providing physically separated compute and I/O resources in the datacenter to enable space and power savings (2015-03-17),
5. 8599557 - Printed circuit board cooling assembly (2013-12-03),
6. 8542488 - Cooling apparatus for an IC (2013-09-24),
7. 8020608 - Heat sink fin with stator blade (2011-09-20),
8. 7926552 - Jacket for heat dispersion device (2011-04-19),
9. 7619899 - Securable electronic module (2009-11-17),
10. 7567438 - Heat sink with precompressed bias member (2009-07-28),
11. 7544072 - Retractable protection apparatus for electronic device pins (2009-06-09),
12. 7516917 - Management device for excess cabling (2009-04-14),
13. 7480143 - Variable-gap thermal-interface device (2009-01-20),
14. 7420816 - Apparatus and method for installing an electrical support structure (2008-09-02),
15. 7408788 - Device and method for circuit board insertion and removal (2008-08-05),

Sure, I can help you with that! Here is the article about inventor Brandon Rubenstein:

Title: Inventor Spotlight: Brandon Rubenstein

Introduction:

Brandon Rubenstein, a prolific inventor based in Loveland, Colorado, has made significant contributions to the technological landscape with his innovative patents and expertise in the field of technology.

Latest Patents:

Brandon Rubenstein's latest patents include a Land Grid Array Socket Assembly, which revolutionizes socket technology by enhancing contact conductivity and durability, and a Fluid Flow Control System for Computing Devices, designed to optimize cooling efficiency in heat-producing computing devices.

Career Highlights:

Having amassed an impressive total of 38 patents, Brandon Rubenstein has showcased his exceptional talent for developing cutting-edge solutions in the tech industry. His work reflects a keen understanding of technological advancements and a commitment to driving innovation forward.

Collaborations:

Throughout his career, Brandon Rubenstein has collaborated with esteemed companies such as Hewlett-Packard Development Company, L.P., and Hewlett-Packard Company. His partnerships with industry leaders have allowed him to further refine his inventions and bring them to fruition in the market.

Conclusion:

In conclusion, Brandon Rubenstein stands out as a trailblazing inventor whose contributions have significantly impacted the world of technology. His dedication to innovation, coupled with his technical acumen, continues to inspire and drive progress in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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