The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Oct. 28, 2010
Applicants:
Brandon Rubenstein, Loveland, CO (US);
Roger Nattkemper, Antelope, CA (US);
Eric R. Daniel, Sacramento, CA (US);
Inventors:
Brandon Rubenstein, Loveland, CO (US);
Roger Nattkemper, Antelope, CA (US);
Eric R. Daniel, Sacramento, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/48 (2006.01); H05K 7/10 (2006.01); G06F 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 7/10 (2013.01); H05K 7/1069 (2013.01); G06F 1/16 (2013.01);
Abstract
A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.