Hewlett-packard Development Company, L.P.

Hewlett-packard Company

Hewlett-packard Development, L.p.

Brandon Rubenstein

Bradley Edgar Clements

Andrew Douglas Delano

Eric C Peterson

Stephan Karl Barsun

Brent A Boudreaux

Eugene Arthur Miksch

Roy M Zeighami

Stephen Daniel Cromwell

Eric R Daniel

Roger Nattkemper

Arlen Lee Roesner

Shaun Lee Harris

Glenn Cochran Simon

Derek Steven Schumacher

Robert J Blakely

Angela L Minichiello

Jeffrey N Metcalf

Wallace K Johnson

William Dale Youngman

Vic Hong Chia

Daniel Paxton

Bradly Clements

John F Hutton

Paige Ringdahl

Richard Stanton Self

A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.

Land grid array socket assembly

Flow measurement systems and methods are provided. A flow measurement system can include at least one heat-producing computing device having at least one fluid inlet and one fluid outlet. The system can further include at least one inlet fluid temperature sensor and at least one outlet fluid temperature sensor. At least one current sensor measuring the current supplied to at least a portion of the at least one heat-producing computing device can also be included with the system. The system can also include at least one calculating device adapted to calculate the inlet fluid flow rate based at least in part upon the sensed inlet fluid temperature, the sensed outlet fluid temperature, and the sensed current flow.

Fluid flow control for computing device

Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.

Heat storage by phase-change material

An embodiment of a system and method disaggregate I/O resources from a server's compute resources, such as CPU and memory, by moving the server's local I/O devices to a remote location apart from the server's compute resources. An embodiment uses optical technology to accomplish the fast communication speeds needed between the compute resources and the remotely located I/O resources. Specifically, an embodiment uses fiber-optic cables and electrical-to-optical conversion to facilitate communication between the compute resources and the I/O resources. The compute resources and the remotely located I/O resources can be designed differently to allow conductive liquid cooling for the compute resources and air cooling for the I/O resources.

System for providing physically separated compute and I/O resources in the datacenter to enable space and power savings

A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board. The main PC boardhas a plurality of connectorsmounted, in a parallel row, onto the top side of the main PC board. A first liquid cooling manifoldis positioned along one end of the parallel row of connectorsand a second liquid cooling manifoldis positioned along the other end of the parallel row of connectors. A plurality of heat sink devices, each having an elongated shape, run parallel to, and on each side of, the plurality of connectors. The plurality of heat sink devicesare coupled to the first and second liquid cooling manifolds.

Printed circuit board cooling assembly

A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.

Cooling apparatus for an IC

Systems, methodologies, and other embodiments are associated with a heat sink with a fin configured with a stator blade. One example includes a heat sink apparatus configured to experience a fan-assisted air flow. The example heat sink apparatus may be configured to include a fan that is configured to produce an air flow in the heat sink apparatus and a heat sink that houses the fan. The example heat sink may include a base and fins that are configured with stator blades.

Heat sink fin with stator blade

An apparatus comprising a heat dispersion device having a first end. The first end has a shape different than that of the remainder of the heat dispersion device. The apparatus also comprises a jacket coupled to the heat dispersion device at the first end. The jacket has another shape associated with that of the remainder of the heat dispersion device.

Jacket for heat dispersion device

Example systems and methods associated with positioning and securing an electronic module to a circuit board are described. In one embodiment, an electronic module comprises at least one connectible portion configured to connect to a circuit board and at least one extended portion having an opening therethrough. In one example, the opening can be configured to maintain a threaded device and to allow the threaded device to move within the opening. The threaded device can be configured to engage a securing device for adjustably securing the at least one extended portion to the circuit board.

Securable electronic module

A subassembly of an apparatus, in one example, includes a first body member and a bias member. A fastener extending through the subassembly applies a compression force to the subassembly. A precompression member is engageable with the subassembly and the bias member so as to impart a precompression force to the bias member. In one example, the fastener is a screw engageable with a threaded plate and biased by a leaf spring which is precompressed to facilitate initial engagement of the screw and the threaded plate.

Heat sink with precompressed bias member

An apparatus for protecting an array of pins of an electronic device is provided. The apparatus includes a pin protector defining an array of holes therethrough, wherein each hole is configured to receive one of the pins. The apparatus also comprises a spring element configured to bias the pin protector away from the electronic device toward an end of each of the pins. The spring element is also configured to allow the pin protector to be retracted toward the electronic device to expose the pins for insertion into a socket or similar component.

Retractable protection apparatus for electronic device pins

A cable management device includes a housing having a forward end, a rearward end, a base, opposing sidewalls, and a pair of vertically-spaced cross-members extending laterally within the housing between the sidewalls. A cable interconnecting electronic devices is routed forward and upwardly around the lower cross-member, rearwardly between the cross-members, rearward and upwardly around the upper cross-member and forwardly out of the housing forward end. The segment of cable extended out of the housing forward end may be pushed longitudinally along the segment back into the cable management device for stowage and subsequently extended back out of the device when needed.

Management device for excess cabling

A method of transferring heat from a heat source to a heat sink using a variable-gap thermal-interface device is provided. The method comprises providing and rotating a multi-axis rotary spherical joint to an orientation to compensate for misalignment between the heat source and heat sink. The method further comprises providing a shim of thickness sufficient to fill a gap between the heat source and multi-axis rotary spherical joint, and inserting the shim to fill the gap.

Variable-gap thermal-interface device

An apparatus and method for installing an electrical support structure, such as a printed circuit board or card within a computerized device, are disclosed. In at least some embodiments, the apparatus includes a first structure, a second structure supported by the first structure and capable of movement with respect to the first structure along a first direction, and a third structure slidingly supported by the second structure. Sliding motion of the third structure with respect to the second structure results in movement of the third structure relative to the first structure that is along a second direction different from the first direction.

Apparatus and method for installing an electrical support structure

Disclosed is a device for insertion and removal of a circuit board into a mating connector positioned within a housing, the device having a first end for pivotal engagement with the circuit board and adapted to mate with a front surface of the housing when the circuit board to which the device is pivotally engaged begins to engage the connector, and a second end disposed longitudinally from the first end and adapted with a latch for releasably mating with a protrusion on the board such that when the board is engaged with the connector the second end becomes releasably mated to the protrusion thereby latching the board to the connector.

Growing community of inventors

Loveland, CO, United States of America

Brandon Rubenstein