Bosco Lan

Title: Bosco Lan: Innovator in Electroplating Technologies

Introduction

Bosco Lan is a notable inventor based in Fremont, California. He has made significant contributions to the field of electroplating and electroless plating technologies. With a total of four patents to his name, his work has advanced the methods of depositing conductive materials in semiconductor applications.

Latest Patents

Bosco Lan's latest patents focus on innovative techniques for electroplating and electroless plating of conductive materials into openings. One of his patents describes a process where a through hole is formed in a semiconductor substrate. A seed layer is sputtered on the bottom surface of the wafer, ensuring that the seed is not deposited over the sidewalls adjacent to the top surface. This allows for effective electroplating of a conductor into the through hole. Another embodiment involves the use of a dry film resist mask to control the deposition of the seed layer. Additionally, he has developed methods for forming dielectrics in openings using non-conformal physical vapor deposition processes.

Career Highlights

Throughout his career, Bosco Lan has worked with several prominent companies, including Tru-Si Technologies, Inc. and Siliconix Incorporated. His experience in these organizations has contributed to his expertise in semiconductor technologies and electroplating processes.

Collaborations

Bosco has collaborated with notable professionals in the field, including Patrick A Halahan and Sam Kao. Their combined efforts have furthered advancements in electroplating technologies.

Conclusion

Bosco Lan's innovative work in electroplating and electroless plating has made a significant impact on semiconductor manufacturing. His patents reflect a deep understanding of the complexities involved in these processes, showcasing his role as a leading inventor in this field.