This inventor holds 1 USPTO granted patent. Top assignee: Tech Semiconductor Singapore Pte Ltd. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: Boon Hong Sim: Innovator in Data Collection Methods
Introduction
Boon Hong Sim is a notable inventor based in Singapore, recognized for his contributions to data collection methodologies in manufacturing processes. His innovative approach has the potential to enhance efficiency and reliability in data handling.
Latest Patents
Boon Hong Sim holds a patent for a "Method for data collection during manufacturing processes." This invention introduces a new data collection method that operates through a middle layer positioned between the host and the equipment. The method significantly improves the speed and consistency of data collection. The middle layer, integrated with this data collection method, acts as both a data format converter and a data processor/classifier. This functionality aids in filtering and formatting messages before transmitting data to the host or equipment. The proposed method allows the middle layer to execute local replies, local data sampling, and group data polling, thereby alleviating the processing demands on both the equipment and the host. This advancement facilitates the implementation of Advanced Process Control (APC) on older wafer fabrication processes utilizing outdated equipment.
Career Highlights
Boon Hong Sim is currently employed at Tech Semiconductor Singapore Pte Ltd, where he applies his expertise in data collection and manufacturing processes. His work has been instrumental in advancing the capabilities of the company in the semiconductor industry.
Collaborations
Boon Hong Sim collaborates with Ping Zhou, a coworker who shares his commitment to innovation in the field of manufacturing processes.
Conclusion
Boon Hong Sim's contributions to data collection methods represent a significant advancement in manufacturing technology. His innovative patent not only enhances data processing efficiency but also supports the use of older equipment in wafer fabrication.