Boo Yang Jung

Title: Boo Yang Jung: Innovator in Semiconductor Technology

Introduction

Boo Yang Jung is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative manufacturing methods that enhance the performance and reliability of semiconductor devices.

Latest Patents

One of his latest patents is for a wafer level fan out semiconductor device and its manufacturing method. This invention provides a first sealing part formed on the lateral surfaces of a semiconductor die. A plurality of redistribution layers are created on the surfaces of the semiconductor die and the first sealing part, with solder balls attached to these layers. The solder balls are strategically arrayed on the semiconductor die and the first sealing part. Additionally, a second sealing part is formed on the semiconductor die, the first sealing part, and the lower portions of the solder balls. This design allows the solder balls to be exposed to the outside through the second sealing part. The materials used for the first and second sealing parts have similar thermal expansion coefficients, which helps to suppress warpage in the wafer level fan out semiconductor device.

Career Highlights

Boo Yang Jung has worked with notable companies in the semiconductor industry, including Amkor Technology, Inc. and Amkor Technology Singapore Holding Pte. Ltd. His experience in these organizations has contributed to his expertise in semiconductor manufacturing processes.

Collaborations

Throughout his career, Boo Yang Jung has collaborated with talented individuals such as Sang Won Kim and Sung Kyu Kim. These collaborations have further enriched his work and innovations in the semiconductor field.

Conclusion

Boo Yang Jung is a key figure in semiconductor innovation, with a focus on improving device manufacturing methods. His contributions continue to influence the industry and pave the way for future advancements.