The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
May. 27, 2010
Sang Won Kim, Seoul, KR;
Boo Yang Jung, Seoul, KR;
Sung Kyu Kim, Seoul, KR;
Min Yoo, Seoul, KR;
Seung Jae Lee, Seoul, KR;
Sang Won Kim, Seoul, KR;
Boo Yang Jung, Seoul, KR;
Sung Kyu Kim, Seoul, KR;
Min Yoo, Seoul, KR;
Seung Jae Lee, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor device and a fabricating method thereof are provided. In one exemplary embodiment, a plurality of semiconductor dies are mounted on a laminating member, for example, a copper clad lamination, having previously formed conductive patterns, followed by performing operations of encapsulating, forming conductive vias, forming a solder resist and sawing, thereby fabricating a chip size package in a simplified manner. Fiducial patterns are further formed on the laminating member, thereby accurately positioning the semiconductor dies at preset positions of the laminating member.