Sunnyvale, CA, United States of America

Bonnie T Chia

USPTO Granted Patents = 6 

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2015-2022

where 'Filed Patents' based on already Granted Patents

6 patents (USPTO):

Title: Innovations of Bonnie T Chia

Introduction

Bonnie T Chia is a prominent inventor based in Sunnyvale, CA (US). She has made significant contributions to the field of technology, particularly in substrate support and electrostatic chuck designs. With a total of 6 patents to her name, her work has had a substantial impact on various applications.

Latest Patents

One of her latest patents is titled "Substrate support with edge seal." This invention provides methods and apparatus for supporting a substrate, which includes a base ring and a clamp ring designed to securely hold the substrate in place. Another notable patent is "Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes." This electrostatic chuck features a dielectric body with a unique design that enhances thermal coupling, making it suitable for sensitive processes.

Career Highlights

Bonnie T Chia is currently employed at Applied Materials, Inc., where she continues to innovate and develop new technologies. Her work has been instrumental in advancing the capabilities of equipment used in semiconductor manufacturing and other high-tech industries.

Collaborations

Throughout her career, Bonnie has collaborated with notable colleagues, including Cheng-Hsiung Matt Tsai and Cheng-Hsiung Matthew Tsai. These collaborations have further enriched her work and contributed to the success of her inventions.

Conclusion

Bonnie T Chia's contributions to technology through her patents and innovations highlight her expertise and dedication to her field. Her work continues to influence advancements in substrate support and electrostatic chuck technologies.

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