The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Apr. 18, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Chang Ke, Sunnyvale, CA (US);

Bonnie Chia, Sunnyvale, CA (US);

Song-Moon Suh, San Jose, CA (US);

Cheng-Hsiung Tsai, Cupertino, CA (US);

Yuanhong Guo, Mountain View, CA (US);

Lei Zhou, Santa Clara, CA (US);

David Langtry, Sunnyvale, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/02 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68721 (2013.01); C23C 16/0227 (2013.01); C23C 16/4557 (2013.01); C23C 16/4585 (2013.01); C23C 16/45565 (2013.01); H01L 21/0209 (2013.01); H01L 21/6719 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/67126 (2013.01); H01L 21/68735 (2013.01);
Abstract

Methods and apparatus for supporting a substrate are provided herein. In some embodiments, a substrate support to support a substrate having a given diameter includes: a base ring having an inner diameter less than the given diameter, the base ring having a support surface configured to contact a first surface of the substrate and to form a seal between the support surface and the first surface of the substrate, when disposed atop the base ring; and a clamp ring having an inner diameter less than the given diameter, wherein the clamp ring includes a contact surface proximate the inner diameter configured to contact an upper surface of the substrate, when present, and wherein the clamp ring and the base ring are further configured to provide a bias force toward each other to clamp the substrate in the substrate support.


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