Company Filing History:
Years Active: 2020-2025
Title: Innovations of BongWoo Choi in Semiconductor Technology
Introduction
BongWoo Choi is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of nine patents. His work focuses on enhancing the performance and reliability of semiconductor devices.
Latest Patents
Among his latest innovations is the "Shielded semiconductor package with open terminal and methods of making." This patent describes a semiconductor device that features a substrate with an electrical component placed over its surface. An encapsulant is deposited over the electrical component and substrate, while a portion of the substrate remains exposed. A shielding layer is then formed over the encapsulant, with a part of it removed to expose the substrate's surface.
Another notable patent is the "Semiconductor device with partial EMI shielding removal using laser ablation." This invention involves a semiconductor device that includes a substrate with both a first and second component. The first component contains an antenna, and a lid is positioned over the substrate between the two components. An encapsulant is deposited over the substrate and lid, with a conductive layer formed on top. A portion of this conductive layer over the first component is removed using laser ablation, enhancing the device's functionality.
Career Highlights
BongWoo Choi is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His expertise and dedication have led to advancements that improve the efficiency and effectiveness of semiconductor devices.
Collaborations
He has collaborated with notable colleagues, including ChangOh Kim and Kyowang Koo, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
BongWoo Choi's contributions to semiconductor technology through his patents demonstrate his commitment to advancing the field. His innovative designs and collaborative efforts continue to shape the future of semiconductor devices.
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