The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Aug. 12, 2020
Applicant:
Stats Chippac Pte. Ltd., Singapore, SG;
Inventors:
ChangOh Kim, Incheon, KR;
KyoWang Koo, Incheon, KR;
SungWon Cho, Seoul, KR;
BongWoo Choi, Seoul, KR;
JiWon Lee, Seoul, KR;
Assignee:
STATS ChipPAC Pte. Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/28 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/56 (2013.01); H01L 23/28 (2013.01); H01L 23/66 (2013.01); H01L 24/94 (2013.01); H01L 25/50 (2013.01); H01L 2021/60112 (2013.01);
Abstract
A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.