This inventor holds 3 USPTO granted patents and 5 published patent applications. Top assignees: Samsung Electronics Ltd., Samsung Electronics Co., Ltd.. Active years: 2025-2026.
Company Filing History:
2 out of 5,587 
1 out of 132,107 
Years Active: 2025-2026
Title: Bongwee Yu: Innovator in Integrated Circuit Technology
Introduction
Bongwee Yu is a prominent inventor based in Anyang, South Korea. He has made significant contributions to the field of integrated circuit technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.
Latest Patents
One of his latest patents is for an integrated circuit device and semiconductor package. This invention includes a first semiconductor chip, a plurality of signal through silicon vias (TSV), a second semiconductor chip, a plurality of signal bumps, and an interposer. The design allows for a reduction in the occupying area of the signal TSVs in the first semiconductor chip, resulting in a smaller integrated circuit device. Another notable patent is for a system on chip that controls the connection of a processing unit to an external capacitor. This innovation aims to reduce voltage droop, enhancing the performance of electronic systems.
Career Highlights
Bongwee Yu has worked with leading companies in the technology sector, including Samsung Electronics Ltd. and Samsung Electronics Co., Ltd. His experience in these organizations has allowed him to develop cutting-edge technologies that push the boundaries of semiconductor design.
Collaborations
Throughout his career, Bongwee Yu has collaborated with talented individuals such as Junso Pak and Heeseok Lee. These partnerships have contributed to the advancement of his innovative projects and patents.
Conclusion
Bongwee Yu's contributions to integrated circuit technology demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of semiconductor design and its applications in modern electronics.