Samsung Electronics Co., Ltd.

Bongwee Yu

Heeseok Lee

Junso Pak

Heejung Choi

A semiconductor package including: a plurality of lower pads; an upper pad; a semiconductor chip including a chip pad and configured to transmit or receive a first signal through the chip pad; a first wiring structure connecting the chip pad to a first lower pad among the plurality of lower pads; and a second wiring structure connecting a second lower pad among the plurality of lower pads to the upper pad, wherein the first lower pad and the second lower pad are separated from each other by a minimum distance between the plurality of lower pads.

Growing community of inventors

Anyang-si, South Korea

Bongwee Yu