The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Dec. 06, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Heejung Choi, Seongnam-si, KR;
Heeseok Lee, Suwon-si, KR;
Junso Pak, Seongnam-si, KR;
Bongwee Yu, Anyang-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package including: a plurality of lower pads; an upper pad; a semiconductor chip including a chip pad and configured to transmit or receive a first signal through the chip pad; a first wiring structure connecting the chip pad to a first lower pad among the plurality of lower pads; and a second wiring structure connecting a second lower pad among the plurality of lower pads to the upper pad, wherein the first lower pad and the second lower pad are separated from each other by a minimum distance between the plurality of lower pads.