Bongju Cho

Title: Bongju Cho: Innovator in Semiconductor Packaging

Introduction

Bongju Cho is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 16 patents. His work has been instrumental in advancing technology in this critical area.

Latest Patents

Among his latest patents, Bongju Cho has developed innovative semiconductor packages. One of his notable inventions includes a semiconductor package that features a first redistribution structure with a first surface and a second surface. This package incorporates a semiconductor chip with a connection pad that is electrically connected to the first redistribution layer. Additionally, it includes a vertical connection structure and an encapsulant that protects the semiconductor chip and the vertical connection structure. Another significant patent involves semiconductor packages with wiring patterns, which consist of a lower redistribution structure and a semiconductor chip. This design includes wiring patterns that extend horizontally and metal patterns that enhance connectivity.

Career Highlights

Bongju Cho is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has not only contributed to the company's success but has also set new standards in the industry.

Collaborations

Throughout his career, Bongju Cho has collaborated with talented individuals such as Myungsam Kang and Youngchan Ko. These collaborations have fostered innovation and have led to the development of groundbreaking technologies in semiconductor packaging.

Conclusion

Bongju Cho's contributions to semiconductor packaging are noteworthy and reflect his dedication to innovation. His patents and collaborations highlight his role as a leading inventor in the field.