The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Aug. 16, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Bongju Cho, Suwon-si, KR;
Myungsam Kang, Suwon-si, KR;
Younggwan Ko, Suwon-si, KR;
Gun Lee, Suwon-si, KR;
Jaekul Lee, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A fan-out semiconductor package includes a first connection structure having first and second surfaces, a first semiconductor chip disposed on the first surface, a first encapsulant disposed on the first surface and covering at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the second surface, one or more first metal members disposed on the second surface, one or more second metal members disposed on the second surface, a second encapsulant disposed on the second surface and respectively covering at least portions of the second semiconductor chip and the first and second metal members, and a second connection structure disposed on an opposite side of a side of the second encapsulant, on which the first connection structure is disposed.