Bokyeong Hwang

Title: The Innovative Contributions of Bokyeong Hwang

Introduction

Bokyeong Hwang is a notable inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor devices, holding a total of 3 patents. His work focuses on enhancing the functionality and efficiency of semiconductor technologies.

Latest Patents

Hwang's latest patents include innovative designs that improve semiconductor devices. One of his patents is for a "Compartment shielding with metal frame and cap." This invention features a substrate with a first semiconductor die and a first metal frame that surrounds the die. The design includes a first metal lid with an elastic flap that latches onto the frame, ensuring secure protection for the semiconductor components. Another patent is titled "Semiconductor device and method of disposing electrical components over side surfaces of interconnect substrate." This invention allows for the placement of electrical components on the side surfaces of an interconnect substrate, optimizing space and enhancing performance.

Career Highlights

Bokyeong Hwang is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Hwang collaborates with talented individuals in his field, including coworkers Jingwan Kim and Minjung Kim. Their combined expertise contributes to the development of cutting-edge technologies in semiconductor design.

Conclusion

Bokyeong Hwang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His innovative designs continue to shape the future of the semiconductor industry.