The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Sep. 07, 2021
Applicant:

Stats Chippac Pte. Ltd., Singapore, SG;

Inventors:

Bokyeong Hwang, Incheon, KR;

Jingwan Kim, Incheon, KR;

Minjung Kim, Incheon, KR;

Assignee:

STATS ChipPAC Pte. Ltd., Singapore, SG;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/051 (2006.01); H01L 21/60 (2006.01); H01L 23/049 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/051 (2013.01); H01L 21/60 (2021.08); H01L 23/049 (2013.01); H05K 9/0024 (2013.01); H05K 9/0032 (2013.01); H05K 9/0033 (2013.01); H01L 2021/60082 (2013.01);
Abstract

A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.


Find Patent Forward Citations

Loading…