Company Filing History:

4 out of 1,812

Stats Chippac Pte. Ltd.

patents

Years Active: 2010-2015

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4 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8994196 - System and method for directional grinding on backside of a semiconductor wafer (2015-03-31),

2. 8035211 - Integrated circuit package system with support structure under wire-in-film adhesive (2011-10-11),

3. 7892072 - Method for directional grinding on backside of a semiconductor wafer (2011-02-22),

4. 7659140 - Integrated circuit system with a debris trapping system (2010-02-09),

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Location History:

Company Filing History:

Years Active: 2010-2015