This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Bo-Yu Chiu: Innovator in Semiconductor Technology
Introduction
Bo-Yu Chiu is an inventor based in Taoyuan, Taiwan. He is known for his contributions to semiconductor technology, focusing on innovative structures and manufacturing methods. Although he currently holds no granted patents, his work in the field is noteworthy.
Latest Patent Applications
Bo-Yu Chiu has submitted several patent applications that showcase his expertise in semiconductor devices. One of his latest applications is titled "Semiconductor Structures with Compact Copper Conductive Features." This application describes a semiconductor device that includes an interconnection structure over a substrate, a first magnetic layer over the interconnection structure, and one or more conductive features over the first magnetic layer. Additionally, a dielectric layer is placed over the first magnetic layer and the conductive features, with a second magnetic layer positioned above the dielectric layer. Notably, the conductive features may include a textured top surface.
Another significant application is "Semiconductor Devices and Methods of Manufacture." This application presents methods for manufacturing semiconductor devices, which involve depositing a first bonding layer on a semiconductor substrate and a metallization layer. The process includes patterning the first bonding layer and substrate to create openings, bonding a second substrate, and subsequently patterning it to form additional openings. This innovative approach enhances the efficiency of semiconductor device manufacturing.
Conclusion
Bo-Yu Chiu is an emerging inventor in the semiconductor field, with promising patent applications that reflect his innovative spirit. His work has the potential to contribute significantly to advancements in semiconductor technology.