Bo Wang

Title: Bo Wang: Innovator in Thermal Process Technology

Introduction

Bo Wang is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of thermal process technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of process chamber lid assemblies.

Latest Patents

One of Bo Wang's latest patents is for a thermal process chamber lid with backside pumping. This innovation describes process chamber lid assemblies and process chambers that incorporate a housing with a gas dispersion channel in fluid communication with a lid plate. The contoured bottom surface of the lid plate defines a gap to the top surface of a gas distribution plate. Additionally, a pumping channel is formed between the upper outer peripheral contour of the gas distribution plate and the lid plate. This design aims to improve the performance of thermal processing applications.

Career Highlights

Bo Wang is currently employed at Applied Materials, Inc., a leading company in the semiconductor and display industries. His role involves developing advanced technologies that contribute to the efficiency of manufacturing processes. His expertise in thermal process technology has positioned him as a valuable asset to his team and the industry.

Collaborations

Throughout his career, Bo Wang has collaborated with several talented individuals, including Anqing Cui and Dien-Yeh Wu. These collaborations have fostered innovation and have led to the development of cutting-edge technologies in their field.

Conclusion

Bo Wang's contributions to thermal process technology through his patents and work at Applied Materials, Inc. highlight his role as an influential inventor. His innovative designs continue to shape the future of manufacturing processes.