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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12387975 B1

PDFFull Text
Date of Patent:
Aug. 12, 2025

Filed:

Jun. 12, 2023

Thermal process chamber lid with backside pumping

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Anqing Cui, Palo Alto, CA (US);

Dien-Yeh Wu, San Jose, CA (US);

Wei V. Tang, Santa Clara, CA (US);

Yixiong Yang, Fremont, CA (US);

Bo Wang, Chandler, AZ (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:

SERVILLA WHITNEY LLC

Primary Examiner:

Erik Kielin

Int. Cl.
CPC ...
H01L 21/768 (2006.01); C23C 16/02 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01L 21/48 (2006.01); H01L 21/687 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76826 (2013.01); C23C 16/02 (2013.01); C23C 16/45553 (2013.01); C23C 16/4584 (2013.01); H01L 21/0228 (2013.01); H01L 21/28568 (2013.01); H01L 21/4871 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01); H01L 21/76843 (2013.01); H01L 21/76861 (2013.01); H01L 21/76877 (2013.01); H01L 23/53266 (2013.01);
Abstract

Process chamber lid assemblies and process chambers comprising same are described. The lid assembly has a housing with a gas dispersion channel in fluid communication with a lid plate. A contoured bottom surface of the lid plate defines a gap to a top surface of a gas distribution plate. A pumping channel is formed between an upper outer peripheral contour of the gas distribution plate and the lid plate.

Find Patent Forward Citations

Cui, Anqing. (2025). Thermal process chamber lid with backside pumping (U.S. Patent No. 12387975). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12387975

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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