Bo-Ruei Cheng

Title: Bo-Ruei Cheng: Innovator in Semiconductor Fabrication

Introduction

Bo-Ruei Cheng is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative methods for fabricating semiconductor devices. His work has implications for the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Cheng holds a patent for a method for fabricating semiconductor devices. This method includes several key steps: forming a trench in a substrate, creating a first oxide layer within the trench, depositing a silicon layer on the first oxide layer, performing an oxidation process to convert the silicon layer into a second oxide layer, and finally planarizing both the second and first oxide layers to establish a shallow trench isolation (STI). This patent reflects his expertise and innovative approach in semiconductor fabrication.

Career Highlights

Throughout his career, Bo-Ruei Cheng has worked with prominent companies in the semiconductor industry. He has been associated with United Microelectronics Corporation and Fujian Jinhua Integrated Circuit Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in semiconductor technology.

Collaborations

Cheng has collaborated with various professionals in his field, including Li-Wei Feng. These collaborations have likely enhanced his research and development efforts, leading to innovative solutions in semiconductor fabrication.

Conclusion

Bo-Ruei Cheng is a distinguished inventor whose work in semiconductor fabrication has made a significant impact on the industry. His patent and career achievements highlight his dedication to innovation and excellence in technology.