Bo Pu

Title: Bo Pu’s Semiconductor Packaging Innovations.

Introduction

Bo Pu is an inventor based in Suwon, South Korea. His patent work includes semiconductor packaging and stacked-package designs. He is associated with Samsung Electronics Co., Ltd., and the supplied information lists 3 patents.

Latest Patents

**Semiconductor package.** This invention describes a package with passivation layers, a substrate containing silicon, and a back-end-of-line (BEOL) layer. Through-silicon vias (TSVs) carry signals between the BEOL layer and lower pads. A ground TSV sits between two signal TSVs, connects to the BEOL layer at one end, and remains floating at the other.

**Stack packages.** This design combines first and second substrate packages, an interposer, and at least one semiconductor chip. The packages and interposer have pads arranged at different pitches, allowing the stack to accommodate differing pad-spacing requirements.

Career Highlights

Pu’s listed inventions address package architecture, electrical connections, and integration of semiconductor components. His work reflects technical approaches to routing signals through package layers and assembling chips and substrates into compact stacks.

Collaborations

The supplied information identifies Jun So Pak and Sung Wook Moon as Pu’s coworkers. It does not specify their roles in the listed patent inventions.

Conclusion

Bo Pu’s patent portfolio, as described here, focuses on semiconductor packaging, including TSV-based signal routing and stacked packages with varied pad pitches.