The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Nov. 22, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package may comprise: a first passivation layer forming an electrical connection with one or more first bumps; a substrate layer including a second passivation layer and a silicon layer; a back-end-of-line (BEOL) layer formed on the substrate layer; and a third passivation layer formed on the BEOL layer forming an electrical connection with one or more second bumps, wherein the substrate layer includes a first signal TSV (Through Silicon Via) which transmits a first signal between the BEOL layer and a first lower pad, a second signal TSV which transmits a second signal between the BEOL layer and a second lower pad, and a ground TSV which is disposed between the first signal TSV and the second signal TSV and formed so that one end thereof is connected to the BEOL layer and the other end thereof floats.