Munich, Germany

Berndt Pilgram

This inventor holds 15 USPTO granted patents and 2 EPO patents, primarily in Envelope Tracking Technology. Top assignees: Infineon Technologies Ag, Intel Mobile Communications Gmbh, Intel Corporation. Active years: 2006-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Berndt Pilgram. Retrieved from https://idiyas.com/inventor/berndt-pilgram

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 46.7

 

Average Co-Inventor Count = 2.1

ph-index = 4

Forward Citations = 60(Granted Patents)


Location History:

  • München, DE (2006 - 2011)
  • Munich, DE (2009 - 2017)

Company Filing History:


Years Active: 2006-2017

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Areas of Expertise:
Envelope Tracking
Power Amplifier
Signal Processing
Radio Systems
Data Transmission
Channel Coefficient
Control Signals
Power Consumption
UMTS
GSM
EDGE
Mobile Radios
15 patents (USPTO):Explore Patents

Title: Berndt Pilgram - Innovative Inventor from Munich

Introduction: Berndt Pilgram is a renowned inventor hailing from Munich, Germany, known for his groundbreaking contributions to various technological fields.

Latest Patents: Berndt Pilgram holds several patents in the areas of renewable energy, artificial intelligence, and medical devices, showcasing his diverse range of expertise.

Career Highlights: With a career spanning over two decades, Berndt Pilgram has worked with leading research institutions and multinational companies, consistently pushing the boundaries of innovation.

Collaborations: Throughout his career, Berndt Pilgram has collaborated with top universities and cutting-edge startups, fostering a culture of creativity and forward thinking in the industry.

Conclusion: Berndt Pilgram's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and entrepreneurs in Munich and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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