This inventor holds 8 USPTO granted patents and 3 published patent applications and 9 EPO patents. Top assignee: Siemens Aktiengesellschaft. Active years: 2022-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022-2026
Title: Bernd Roppelt: Innovator in Semiconductor Cooling Technologies
Introduction
Bernd Roppelt is a distinguished inventor based in Munich, Germany. He has made significant contributions to the field of semiconductor cooling technologies, holding a total of 8 patents. His innovative approaches leverage artificial intelligence to enhance the efficiency and longevity of electronic components.
Latest Patents
One of Bernd Roppelt's latest patents is a "Method for determining heat-sink contamination by means of artificial intelligence." This method involves capturing a load curve controlled by the electronic component and a temperature curve along the heat transfer chain to the heat sink. During the training phase, a decision function is established for application to portions of the load and temperature curves. In the classification phase, the system detects a non-soiled state of the heat sink based on the similarity of the captured data to the training phase data.
Another notable patent is focused on "Cooling of semiconductors for optimised service life." This method determines the time profile of a semiconductor's load over a specified period. The cooling apparatus is then controlled based on the load cycle derived from this time profile, ensuring optimal cooling performance.
Career Highlights
Bernd Roppelt is currently employed at Siemens Aktiengesellschaft, a leading global technology company. His work at Siemens has allowed him to apply his innovative ideas in practical applications, contributing to advancements in semiconductor technology.
Collaborations
Throughout his career, Bernd has collaborated with notable colleagues, including Thomas Schwinn and Jens Schmenger. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Bernd Roppelt's contributions to semiconductor cooling technologies exemplify the impact of innovation in enhancing electronic component performance. His patents reflect a commitment to advancing technology through intelligent solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile