The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Jun. 11, 2021
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Roman Kögler, Nuremberg, DE;

Alexander Luft, Nuremberg, DE;

Bernd Roppelt, Unterhald, DE;

Jens Schmenger, Forchheim, DE;

Thomas Schwinn, Herzogenaurach, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/03 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20909 (2013.01); H05K 5/03 (2013.01); H05K 7/20154 (2013.01);
Abstract

A power module includes a power unit. The power unit includes a power semiconductor and a substrate. In order to improve the reliability of the power module, the substrate of the power unit is directly connected in an integrally bonded manner to a surface of a heat sink. The power unit is surrounded at least partially by a housing. The housing includes a housing frame which is connected liquid-tight to the surface of the heat sink and formed from a first dielectric material, and a housing cover which is connected to the housing frame to close the housing and is formed from a second dielectric material.


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