Siemens Aktiengesellschaft

Bernd Roppelt

Lutz Namyslo

Jens Schmenger

Thomas Schwinn

Roman Kögler

Lucia Hirsch

Jürgen Kimpel

A method for determining soiling of a heat sink for cooling an electronic component is disclosed. A load curve controlled by the component and a temperature curve along a heat transfer chain from the at least one component to the heat sink are continuously captured. In a training phase, a decision function is determined, which is provided for application to a portion of the load curve and to at least one correspondingly captured portion of a temperature curve. In a classification phase, a non-soiled state of the heat sink is detected when the portion of the load curve presented to the decision function is similar to the portions of the load curve captured in the training phase and when the at least one corresponding portion of a temperature curve is similar to the portions of the temperature curve in question that were correspondingly captured in the training phase.

Method for determining heat-sink contamination by means of artificial intelligence

In a method for cooling a semiconductor, a time profile of a load of the semiconductor is determined over a predefinable period of time. A cooling apparatus for cooling the semiconductor is controlled or regulated depending on a load cycle of the semiconductor resulting from the determined time profile of the load, and the cooling apparatus is controlled or regulated as a function of the load averaged over the predefinable period of time.

Cooling of semiconductors for optimised service life

A power module includes a heat sink, a power unit formed at least partially inside the heat sink and/or on the heat sink and comprising a semiconductor element and a substrate, and a device designed to enclose the power unit and to center a control unit with respect to the power unit. The device includes a frame designed to surround the substrate at least partially, a first projecting section designed to engage in a recess or an opening of the heat sink, and a second projecting section designed to engage in a recess or an opening or a notch of the control unit and to have an outline which when viewed in cross-section is at least essentially star-shaped with at least a first leg, a second leg and a third leg.

Power module

A wiring of a semiconductor switch having a gate, a collector or a drain, and an emitter or a source, includes a first arrangement having a first capacitor connected in series with a parallel connection having a first resistor and a first diode. The first arrangement is connected between the gate and the collector or drain, wherein the first diode is connected away from the gate in a flow direction. A second arrangement is connected in parallel with the first arrangement and includes a second capacitor connected in series with a parallel connection having a second resistor and a second diode, wherein the second diode lies toward the gate in the flow direction.

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Munich, Georgia

Bernd Roppelt