Benlih Huang

Title: The Innovations of Benlih Huang

Introduction

Benlih Huang is a notable inventor based in New Hartford, NY (US). He has made significant contributions to the field of solder technology, holding a total of three patents. His work focuses on enhancing the properties of solders, particularly in lead-free applications.

Latest Patents

Huang's latest patents include a technique for increasing the compliance of tin-indium solders. This technique involves a lead-free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight of at least one rare earth element. Another significant patent is a technique for increasing the compliance of lead-free solders containing silver. This technique can be realized in various alloy compositions, including Sn—Ag—Al and Sn—Ag—Cu—Al, among others, with specific percentages of silver, aluminum, and copper balanced with tin.

Career Highlights

Benlih Huang is currently employed at Indium Corporation of America, where he continues to innovate in the field of solder technology. His expertise and inventions have contributed to advancements in lead-free solder applications, which are crucial for modern electronics.

Collaborations

Huang has collaborated with notable colleagues such as Hong-Sik Hwang and Ning-Cheng Lee. These collaborations have further enriched his research and development efforts in solder technology.

Conclusion

Benlih Huang's contributions to solder technology through his innovative patents demonstrate his commitment to advancing the field. His work not only enhances the performance of solders but also supports the growing demand for environmentally friendly materials in electronics.