The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Oct. 18, 2006
Benlih Huang, New Hartford, NY (US);
Hong-sik Hwang, Clinton, NY (US);
Ning-cheng Lee, New Hartford, NY (US);
Benlih Huang, New Hartford, NY (US);
Hong-Sik Hwang, Clinton, NY (US);
Ning-Cheng Lee, New Hartford, NY (US);
Indium Corporation of America, Utica, NY (US);
Abstract
A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al—Ni composition comprising (0.01-20)% Ag, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al—Ni alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn.