The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Feb. 24, 2006
Applicants:
Benlih Huang, New Hartford, NY (US);
Hong-sik Hwang, Clinton, NY (US);
Ning-cheng Lee, New Hartford, NY (US);
Inventors:
Benlih Huang, New Hartford, NY (US);
Hong-Sik Hwang, Clinton, NY (US);
Ning-Cheng Lee, New Hartford, NY (US);
Assignee:
Indium Corporation of America, Utica, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
C22C 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.