Benjamin L McClain

This inventor holds 20 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Manufacturing. Top assignee: Micron Technology Incorporated. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Benjamin L McClain. Retrieved from https://idiyas.com/inventor/benjamin-l-mcclain

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 (Patent Applications = 3)

% Patents Active = 95.0

Average Co-Inventor Count = 2.9

ph-index = 3

Forward Citations = 23(Granted Patents)

Company Filing History:

20 out of 39,222

Micron Technology Incorporated

patents

Years Active: 2018-2026

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Areas of Expertise:

Semiconductor Device Assembly

Moisture Voiding Elimination

Thermocompression Bond Tips

Solder Bridging Elimination

Cold Fluid Release

3D Ink Jet Interconnect Control

Surface-Mount Structures

Stress Reduction Techniques

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12642095 - Method for substrate moisture NCF voiding elimination (2026-05-26),

2. 12087720 - Semiconductor device assembly with surface-mount die support structures (2024-09-10),

3. 12080678 - Methods and systems for manufacturing semiconductor devices (2024-09-03),

4. 11705425 - Thermocompression bond tips and related apparatus and methods (2023-07-18),

5. 11670612 - Method for solder bridging elimination for bulk solder C2S interconnects (2023-06-06),

6. 11594432 - Cold fluid semiconductor device release during pick and place operations, and associated systems and methods (2023-02-28),

7. 11410963 - Methods and systems for manufacturing semiconductor devices (2022-08-09),

8. 11410962 - Methods and systems for manufacturing semiconductor devices (2022-08-09),

9. 11024595 - Thermocompression bond tips and related apparatus and methods (2021-06-01),

10. 10998208 - Cold fluid semiconductor device release during pick and place operations, and associated systems and methods (2021-05-04),

11. 10952333 - Method for stress reduction in semiconductor package via carrier (2021-03-16),

12. 10950568 - Semiconductor device assembly with surface-mount die support structures (2021-03-16),

13. 10879195 - Method for substrate moisture NCF voiding elimination (2020-12-29),

14. 10840210 - Methods and systems for manufacturing semiconductor devices (2020-11-17),

15. 10840209 - Methods and systems for manufacturing semiconductor devices (2020-11-17),

Title: The Innovative Journey of Benjamin L. McClain

Introduction: Benjamin L. McClain, a talented inventor based in Boise, ID (US), has made significant contributions to the field of innovations with his creative mindset and dedication to problem-solving.

Latest Patents: Benjamin L. McClain holds several patents in various industries, showcasing his versatility and ingenuity in inventing new solutions to complex challenges.

Career Highlights: Throughout his career, Benjamin L. McClain has demonstrated a keen ability to identify gaps in the market and develop groundbreaking inventions that have the potential to improve the lives of many. His passion for innovation has driven him to push the boundaries of what is possible.

Collaborations: Benjamin L. McClain has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His collaborative spirit and willingness to work with others have been instrumental in the success of his projects.

Conclusion: In conclusion, Benjamin L. McClain stands as a shining example of an inventor who is not afraid to think outside the box and challenge the status quo. His innovative spirit and determination continue to inspire others in the field of inventions.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

3 patents pending: