Taichung, Taiwan

Ben-Shu Chen

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ben-Shu Chen. Retrieved from https://idiyas.com/inventor/ben-shu-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Ben-Shu Chen and Semiconductor Process Innovation.

Introduction

Ben-Shu Chen is an inventor associated with Taichung, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. His patent work addresses slurry flow control and monitoring for chemical mechanical polishing, a process used in semiconductor manufacturing.

Latest Patents

Chen is credited with 1 patent: “Slurry Flow Control and Monitor System for Chemical Mechanical Polisher.” The invention describes a system that uses a pump to move slurry and a flow meter to monitor its flow rate. A controller receives signals from the flow meter and adjusts the pump’s operating speed in response. The system may also include a degasser with a level sensor to remove gas bubbles from the slurry.

Career Highlights

Chen’s patented system focuses on controlling and monitoring slurry flow during chemical mechanical polishing. By linking flow measurements to pump-speed adjustments, the design provides a way to regulate the process fluid. The patent record associates Chen with Taiwan Semiconductor Manufacturing Company Limited.

Collaborations

Chao-Jung Chang and Chin-Hsin Peng are identified as Chen’s coworkers. The available information does not specify their roles in the patent or describe any direct collaboration with him.

Conclusion

Ben-Shu Chen’s patent reflects an engineering contribution to semiconductor manufacturing, centered on monitoring and regulating slurry flow in chemical mechanical polishing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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