Bassam Mohammed Ziadeh

Title: Innovator Bassam Mohammed Ziadeh: Pioneering Solutions in Device Packaging

Introduction

Bassam Mohammed Ziadeh, a prominent inventor based in Gilbert, AZ, has made significant contributions to the field of device packaging through his innovative solutions. With a remarkable portfolio of 17 patents, Bassam continues to push the boundaries of technology, focusing on enhancing the performance and reliability of device packages.

Latest Patents

Among his latest patents, Bassam has developed a "Low Cost Package Warpage Solution." This invention outlines methods of forming device packages by creating a reinforcement layer over a substrate, integrating one or more openings for device dies. His approach allows the bonding of the device die to the substrate via reflowing solder bumps, ensuring reliability in electronic devices.

Another notable patent is the "Hydrophobic Feature to Control Adhesive Flow." This invention focuses on the implementation of hydrophobic features designed to regulate the spread of epoxy, either on the die surface or substrate surface. By strategically placing these features, Bassam's designs prevent unwanted epoxy flow, thereby enhancing the structural integrity of the package. These innovations showcase his commitment to solving complex problems in the technology sector.

Career Highlights

Bassam currently works at Intel Corporation, a leader in semiconductor manufacturing and technology. His role involves working at the intersection of innovation and practical engineering, contributing to groundbreaking methodologies that define the future of electronic packaging.

Collaborations

Throughout his career, Bassam has collaborated with talented colleagues such as Omkar G Karhade and Nitin A Deshpande. These collaborations highlight his ability to work effectively within a team, fostering an environment conducive to creativity and innovation.

Conclusion

Bassam Mohammed Ziadeh stands out as an influential inventor whose work has far-reaching implications in the electronic packaging industry. His extensive patent portfolio and innovative solutions reflect his dedication to advancing technology. As he continues to develop new ideas and solve existing challenges, Bassam remains a key figure in the ongoing evolution of modern devices.