The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Jun. 30, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Bassam Ziadeh, Gilbert, AZ (US);
John Lofgren, Gilbert, AZ (US);
Santosh Pabba, Aloha, OR (US);
Kevin Pounds, Aloha, OR (US);
Alin Ila, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H05K 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 13/0084 (2013.01);
Abstract
A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.