This inventor holds 4 USPTO granted patents and 2 published patent applications. Top assignees: Siliconix Incorporated, Cyntec Company, Nxp B.v.. Active years: 1998-2025.
Company Filing History:
2 out of 256 
1 out of 231 
1 out of 5,317 
Years Active: 1998-2025
Title: Barry Lin: Innovator in Semiconductor Packaging
Introduction
Barry Lin is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative techniques have advanced the design and functionality of semiconductor packages, making them more efficient and effective.
Latest Patents
Barry Lin's latest patents include groundbreaking methods for semiconductor packages with side wall plating. One of his notable inventions involves a dual flat no-leads semiconductor package. This technique begins with a package assembly that includes multiple non-singulated packages. The assembly features a lead frame with dies coupled to it, and a mold encapsulation that covers portions of the dies while exposing a plurality of leads. The process includes a series of cutting and electroplating steps that ultimately singulate the dies into individual packages. Another patent focuses on forming wettable flanks on quad flat no-leads semiconductor packages. This method also starts with a package assembly and involves a series of parallel step cuts and electroplating to create discrete QNF semiconductor packages.
Career Highlights
Throughout his career, Barry Lin has worked with notable companies in the semiconductor industry, including Siliconix Incorporated and NXP B.V. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in semiconductor technology.
Collaborations
Barry has collaborated with esteemed colleagues such as Shih Chang Liao and Duen Jen Cheng. Their combined expertise has fostered innovation and development in the semiconductor field.
Conclusion
Barry Lin is a distinguished inventor whose work in semiconductor packaging has led to multiple patents and advancements in technology. His contributions continue to influence the industry and pave the way for future innovations.