This inventor holds 2 USPTO granted patents. Top assignees: International Business Machines Corporation, Stmicroelectronics Gmbh. Active years: 2013-2017.
Company Filing History:
2 out of 166,159 
2 out of 2,891 
Years Active: 2013-2017
Title: The Innovations of Balasingham Bahierathan
Introduction
Balasingham Bahierathan is an accomplished inventor based in Fishkill, NY (US). He has made significant contributions to the field of technology, particularly in the area of defect localization in semiconductor manufacturing. With a total of 2 patents, his work has garnered attention for its innovative approaches and practical applications.
Latest Patents
Bahierathan's latest patents include "Via chains for defect localization - Via chain and serpentine/comb test structures in kerf areas of a wafer." This patent describes a method for forming via chain test structures that comprise a first and second via chain in a kerf area. The structures are designed such that geometrically shaped portions of both chains alternate along the length of the kerf area. His second patent, "Via chains for defect localization - Method form via chain and serpentine/comb test structures in kerf areas of a wafer," outlines methods for performing low and high magnification testing to identify defective geometrically shaped portions containing defective via structures.
Career Highlights
Throughout his career, Bahierathan has worked with notable companies such as STMicroelectronics GmbH and IBM. His experience in these organizations has allowed him to refine his skills and contribute to various projects that push the boundaries of technology.
Collaborations
Some of his coworkers include Christopher B D'Aleo and Gregory M Johnson. Their collaboration has likely contributed to the innovative solutions that Bahierathan has developed over the years.
Conclusion
Balasingham Bahierathan's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as a significant inventor. His work continues to influence the industry and pave the way for future innovations.