Company Filing History:
2 out of 22 
1 out of 16,453 
Years Active: 2016-2017
Title: The Innovative Mind of Atsushi Irisawa: Pioneering Lead-Free Solder Technologies
Introduction: Atsushi Irisawa is a notable inventor based in Tokyo, Japan, recognized for his contributions to the field of solder materials and technologies. With a total of two patents, Irisawa's work is dedicated to evolving the standards and performance of soldering solutions, particularly in applications required for demanding environments.
Latest Patents: Atsushi Irisawa's latest innovations include a lead-free solder alloy and a solder material designed for joined structures. His first patent features a lead-free solder alloy that contains antimony (Sb) in an amount greater than 3.0% but not exceeding 10% by mass, with the balance comprising tin (Sn) and other elements. The second patent focuses on a solder paste that enhances the reliability of surface mounting structures for electronic components. This paste is specifically engineered to endure up to 100 heat-shock cycles, ranging from -40°C to 150°C, a critical requirement for vehicular applications near engines. The formulation includes an amine halogen salt and a dicarboxylic acid kneaded with a Sn–Ag–Bi–In alloy powder, yielding a solder paste that exhibits impressive printability, minimal solder ball formation, and outstanding joinability without cracking in extreme thermal conditions.
Career Highlights: Throughout his career, Atsushi Irisawa has made significant strides in the soldering industry. He has worked with notable companies such as Koki Company Limited and Panasonic Corporation, where he has honed his expertise in solder materials and engineering processes.
Collaborations: During his professional journey, Irisawa has collaborated with talented individuals, including Rie Wada and Masashi Kashiwabara. Their joint efforts have contributed to advancements in solder technologies and applications.
Conclusion: Atsushi Irisawa's innovative work exemplifies the crucial role of inventors in shaping reliable and efficient materials for electronics. His patents not only reflect his dedication to the field but also highlight a commitment to creating sustainable and resilient solutions that address the challenges faced in modern technology.