The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Feb. 19, 2015
Applicant:
Koki Company Limited, Tokyo, JP;
Inventors:
Atsushi Irisawa, Tokyo, JP;
Rie Wada, Tokyo, JP;
Assignee:
KOKI Company Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); B23K 35/36 (2006.01); B23K 35/26 (2006.01); B23K 35/02 (2006.01); C22C 13/02 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/0222 (2013.01); B23K 35/26 (2013.01); B23K 35/36 (2013.01); C22C 13/02 (2013.01); H01L 24/16 (2013.01); H05K 3/3463 (2013.01); B23K 2201/40 (2013.01); H01L 2224/1362 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13657 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01032 (2013.01);
Abstract
Provided are a lead-free solder alloy which consists of Sb in an amount of more than 3.0% but 10% or less by mass, and the balance including Sn, and others.