Company Filing History:
Years Active: 2017
Title: Rie Wada - Innovator in Solder Paste Technology
Introduction
Rie Wada is an inventor based in Itabashi-ku, Japan. He has made significant contributions to the field of solder paste technology. His innovative approach focuses on the formulation of solder paste that enhances performance and usability in various applications.
Latest Patent Applications
Rie Wada's notable patent application is for a solder paste that includes, within a flux, an activator comprising a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less. The solder paste also contains at least one resin additive selected from high-density polyethylenes and polypropylenes. This formulation specifies that the resin additive should be present in an amount of 4% by weight or greater and 12% by weight or less, based on the total amount of the flux being 100% by weight. Additionally, the solder paste is designed to have a viscosity of Pa·s or greater at 80° C.
Conclusion
Rie Wada's work in solder paste technology showcases his innovative spirit and dedication to improving materials used in electronics. His contributions are expected to influence the industry positively.