The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Mar. 09, 2011
Atsushi Irisawa, Tokyo, JP;
Masashi Kashiwabara, Saitama, JP;
Kenji Kondo, Nara, JP;
Masahito Hidaka, Osaka, JP;
Atsushi Irisawa, Tokyo, JP;
Masashi Kashiwabara, Saitama, JP;
Kenji Kondo, Nara, JP;
Masahito Hidaka, Osaka, JP;
KOKI COMPANY LIMITED, Tokyo, JP;
PANASONIC CORPORATION, Osaka, JP;
Abstract
The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at −40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at −40° C. to 150° C. is obtained.