Chandler, AZ, United States of America

Ashok K Seth


Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 76(Granted Patents)


Company Filing History:


Years Active: 1996-1998

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3 patents (USPTO):Explore Patents

Title: Innovations by Ashok K Seth in Integrated Circuit Packaging

Introduction

Ashok K Seth is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 3 patents. His work primarily focuses on methods for soldering ball grid array (BGA) integrated circuit packages to printed circuit boards.

Latest Patents

Among his latest patents is a fixture for handling and attaching conductive spheres to a substrate. This method involves applying solder flux to the conductive surface pads of a printed circuit board and capturing a plurality of solder balls with a separate fixture. The fixture is then placed onto the printed circuit board, allowing the solder balls to be released onto the conductive surface pads. After the fixture is removed, an integrated circuit package is placed onto the solder balls. Solder flux may also be applied to the bottom of the package to ensure adherence to the balls. The solder balls are subsequently reflowed to attach the package to the board, with the flux acting as a bonding agent that maintains the position of the solder balls and package during the reflow process. Another method described in his patents includes placing a fixture adjacent to the integrated circuit package, aligning openings in the fixture with surface pads on the package's bottom surface. Solder balls are then placed into the fixture holes, and after reflowing the solder, the fixture is removed, allowing the package and solder balls to be soldered to a printed circuit board.

Career Highlights

Ashok K Seth is currently employed at Intel Corporation, where he continues to innovate in the field of electronics. His work has been instrumental in improving the efficiency and reliability of integrated circuit packaging.

Collaborations

He has collaborated with notable colleagues, including Debendra Mallik and Joni G Hansen, contributing to advancements in their shared field of expertise.

Conclusion

Ashok K Seth's contributions to integrated circuit packaging through his innovative patents have significantly impacted the electronics industry. His work at Intel Corporation and collaborations with esteemed colleagues further highlight his role as a leading inventor in this field.

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