Intel Corporation

Ashok K Seth

Debendra Mallik

Joni G Hansen

Neil R Sugai

Koushik Banerjee

Methods for soldering a ball grid array (BGA) integrated circuit package to a printed circuit board. One method includes the steps of applying a solder flux to the conductive surface pads of a printed circuit board and capturing a plurality of solder balls with a separate fixture. The fixture is then placed onto the printed circuit board and the solder balls are released onto the conductive surface pads. The fixture is removed and an integrated circuit package is placed onto the solder balls. Solder flux may be applied to the bottom of the package to adhere the package to the balls. The solder balls are then reflowed to attach the package to the board. The flux provides a bonding agent which maintains the position of the solder balls and package while the solder is being reflowed. Another method includes the step of placing a fixture adjacent to the integrated circuit package so that a plurality of openings in the fixture are aligned with surface pads located on the bottom surface of the package. Solder balls are then placed into the fixture holes, adjacent to the surface pads of the package. The solder is then reflowed and the fixture is removed so that the package and solder balls can be subsequently soldered to a printed circuit board.

Fixture for handling and attaching conductive spheres to a substrate

Method for attaching and handling conductive spheres to a substrate

An integrated circuit package which has internal bonding pads that are located on bonding shelves and coupled to internal conductive power/ground planes by conductive strips that extend along the edges of the shelves. The edge strips eliminate the need for conventional vias to couple the bonding pads to the planes and thus reduce the cost and size of the package and improve package electrical performance (less inductive, less resistance path). The bonding pads are coupled to an integrated circuit that is mounted to a heat slug attached to a top surface of the package. The heat slug can function as both a ground path and a thermal sink for the integrated circuit. The package may have capacitors coupled to the internal routing of the package to reduce the electrical noise of the signals provided to the integrated circuit. Additionally, the package may have multiple power planes dedicated to different voltage levels. The bonding pads and conductive planes are coupled to landing pads located on a bottom surface of the package. Attached to the landing pads are solder balls which can be soldered to an external printed circuit board.

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Chandler, AZ, United States of America

Ashok K Seth