MORRISVILLE, NC, United States of America

Arvind Modekurti

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.6

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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3 patents (USPTO):Explore Patents

Title: Arvind Modekurti: Innovator in Cooling Systems

Introduction

Arvind Modekurti is a notable inventor based in Morrisville, NC (US). He has made significant contributions to the field of cooling systems, particularly in the context of electronic components. His innovative approach has led to the development of a patented technology that enhances the efficiency of heat transfer in electronic devices.

Latest Patents

Arvind Modekurti holds a patent for "Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic component." This patent describes a cooling system that includes a conduit designed to be in conductive heat transfer interface with an electronic component. The conduit effectively transfers a first portion of heat from the electronic component to a flow of cooling liquid. Additionally, the heat transfer device is configured to interface with the electronic component to transfer a second portion of heat. The system also features a heat collector manifold that receives the flow of cooling liquid, ensuring efficient heat management.

Career Highlights

Arvind Modekurti is currently employed at Lenovo Global Technology (United States) Inc., where he continues to innovate in the field of cooling systems. His work focuses on improving the thermal management of electronic devices, which is crucial for enhancing performance and longevity.

Collaborations

Throughout his career, Arvind has collaborated with notable colleagues, including Jeffrey Scott Holland and Vinod Kamath. These collaborations have contributed to the advancement of technology in their respective fields.

Conclusion

Arvind Modekurti's contributions to cooling systems demonstrate his commitment to innovation and excellence in technology. His patented work not only addresses critical challenges in heat transfer but also showcases the importance of effective thermal management in electronic devices.

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