Lenovo Global Technology (United States) Inc.

Arvind Modekurti

Vinod Kamath

Jeffrey Scott Holland

Detecting coolant leaks in a server system including receiving, by a controller in the server system with nodes stacked vertically, a voltage fault alert from a first node; receiving, by the controller in the server system with nodes stacked vertically, a voltage fault alert from a second node located below the first node; and upon receiving the voltage fault alert from the first node and the voltage fault alert from the second node, powering down, by the controller, one or more nodes located below the second node.

System and method for detecting coolant leaks in a server system

Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic component are disclosed. According to an aspect, a cooling system includes a conduit configured to be in conductive heat transfer interface with an electronic component. The conduit is configured to transfer a first portion of heat from the electronic component to a flow of a cooling liquid. The heat transfer device is also configured to be in conductive heat transfer interface with the electronic component, and to transfer a second portion of heat from the electronic component. The cooling system includes a heat collector manifold configured to receive the flow of the cooling liquid with the first portion of heat from the conduit, to receive the second portion of heat via conductive heat transfer from the heat transfer device, and to transfer the second portion of heat to the flow of the cooling liquid.

Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic component

An apparatus for a hybrid single-phase/two-phase cooling loop to enhance cooling of components in a computing device is disclosed. The apparatus includes a single-phase cooling loop routed through a first part of a component. The component includes semiconductor devices. The single-phase cooling loop includes a fluid configured to remain in a liquid state after removing heat from the first part of the component. The apparatus includes a two-phase cooling loop routed through a second part of a component. The two-phase cooling loop includes a dielectric fluid configured to at least partially transition from a liquid state to a gas state at a selected temperature of a semiconductor device of the second part of the component while removing heat from the second part of the component.

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MORRISVILLE, NC, United States of America

Arvind Modekurti