The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Sep. 30, 2022
Applicant:

Lenovo Enterprise Solutions (Singapore) Pte Ltd., Singapore, SG;

Inventors:

Jeffrey Holland, Morrisville, NC (US);

Arvind Modekurti, Morrisville, NC (US);

Vinod Kamath, Morrisville, NC (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); G06F 1/20 (2013.01); H05K 7/20509 (2013.01); G06F 2200/201 (2013.01);
Abstract

Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic component are disclosed. According to an aspect, a cooling system includes a conduit configured to be in conductive heat transfer interface with an electronic component. The conduit is configured to transfer a first portion of heat from the electronic component to a flow of a cooling liquid. The heat transfer device is also configured to be in conductive heat transfer interface with the electronic component, and to transfer a second portion of heat from the electronic component. The cooling system includes a heat collector manifold configured to receive the flow of the cooling liquid with the first portion of heat from the conduit, to receive the second portion of heat via conductive heat transfer from the heat transfer device, and to transfer the second portion of heat to the flow of the cooling liquid.


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