Tempe, AZ, United States of America

Arul Vigneswar Ravichandran

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Asm IP Holding B.v.. Active years: 2026.

USPTO Granted Patents = 2 

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Arul Vigneswar Ravichandran: Innovator in Substrate Surface Technologies

Introduction

Arul Vigneswar Ravichandran is a notable inventor based in Tempe, AZ (US). He has made significant contributions to the field of substrate surface technologies. His innovative work has led to the development of a patent that addresses critical challenges in this area.

Latest Patents

Ravichandran holds a patent titled "Methods and systems for filling gap features on substrate surfaces." This patent describes methods and systems for forming a structure by providing a substrate with a gap within a reaction chamber. The exemplary methods include selectively depositing a first material comprising molybdenum on a first surface within the gap relative to a second surface within the gap to at least partially fill the gap. After this step, a second material comprising molybdenum is conformally deposited over both surfaces. This innovative approach enhances the efficiency and effectiveness of substrate surface treatments.

Career Highlights

Ravichandran is associated with Asm IP Holding B.V., where he continues to develop and refine his innovative ideas. His work has garnered attention for its potential applications in various industries, particularly in semiconductor manufacturing and materials science.

Collaborations

Ravichandran has collaborated with talented individuals such as Yasiel Cabrera and YoungChol Byun. These collaborations have contributed to the advancement of his research and the successful implementation of his patented technologies.

Conclusion

Arul Vigneswar Ravichandran is a distinguished inventor whose work in substrate surface technologies has led to valuable innovations. His patent on filling gap features demonstrates his commitment to advancing the field and addressing industry challenges.

Profile summary based on public USPTO records.
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