The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Nov. 18, 2022
Asm Ip Holding B.v., Almere, NL;
Jiyeon Kim, Tempe, AZ (US);
Youngchol Byun, Tempe, AZ (US);
Petri Raisanen, Gilbert, AZ (US);
Dong Li, Phoenix, AZ (US);
Eric James Shero, Phoenix, AZ (US);
Yasiel Cabrera, Phoenix, AZ (US);
Arul Vigneswar Ravichandran, Tempe, AZ (US);
Eric Christopher Stevens, Tempe, AZ (US);
Paul MA, Scottsdale, AZ (US);
ASM IP Holding B.V., Almere, NL;
Abstract
Molybdenum (Mo) metal-on-metal (MoM) deposition methods for providing true bottom-up fill in vias and/or other gap features in device structures. These device structures contain metal at the bottom surface and have dielectric sidewalls. The deposition process provides molybdenum growth only, in some cases, on the metal film/layer to provide a selective process that can be called a metal-on-metal (MoM) process. The Mo MoM deposition process described herein are not limited to thin films (e.g., films less than 50 Å) and can be used to deposit thicker films (e.g., greater than 50 Å in some cases and greater than 200 Å in other useful cases) on metal surfaces while no, or substantially no, deposition is found on dielectric surfaces.